Gigabyte B560M AORUS PRO Intel Motherboard

  • Part Number: B560M AORUS PRO
  • Manufacturer: Gigabyte
  • Quickfind Code: 135650

  • Stock: Out Stock

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Product Features:
  • Condition: New
  • Form Factor mATX
  • CPU Type Intel
  • Memory Type DDR4
  • Socket Type 1200
  • Chipset B560
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Product Description

The B560M AORUS PRO AX comes with upgraded power solution, incredible cooling design, all PCIe 4.0 design and outstanding connectivity to elevate your gaming experience to the next level.

DIRECT POWER DESIGN

B560M AORUS motherboard uses an 12+1 phases digital CPU power design which includes both digital PWM Controller and DrMOS. These 100% digital controller and additional 8 Solid-pin CPU Power Connectors offer incredible precision in delivering power to the motherboard's most power-hungry and energy-sensitive components, allowing enthusiasts to get the absolute maximum performance from the new Intel 11th Gen CPU.

12+1 Phases Digital Power Design

More efficient and cleaner power delivers to the CPU ensures stable performance under heavy loading.
Digital PWM Controller to deliver appropriate voltage to the CPU.

  • Direct 12+1 Phases DrMOS without PWM Doublers, each power phase connects directly to the CPU, With capability to handle 600 Amps current in total.
  • All-solid capacitors to improve Transient response and minimize oscillation.
  • 8 Solid Pin CPU Power Connectors.

ADVANCED THERMAL SOLUTION

B560M AORUS uses high performance Fully Covered thermal design with high coverage MOSFET Heatsinks and thick thermal pad, providing ultimate MOSFET cooling performance for enthusiasts, overclockers and gamers.

Thermal Design

  • Fully Covered Thermal Design - High coverage MOSFET Heatsinks to improve thermal efficiency with better airflow and heat exchange.
  • Thick Thermal Pad - Thick 5W/mk thermal pad.
  • M.2 Thermal Guard - Built-in M.2 heatsink prevent high-speed, PCIe 4.0 SSDs from throttling due to overheating.

Fully Covered MOSFET Heatsink

2X larger Surface

Increased surface area up to 2X larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs.

Real One-piece Build

TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors’ multi-piece design

Multi-cut Design

TMOS features several channels and inlets on the heatsink. This design allows for the air flow to go through which leads to a great improvement of the heat transfer performance.

M.2 Thermal Guard

GIGABYTE Ultra-Efficient M.2 Thermal Guard

With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.

Smart Fan 6

Smart Fan 6 contains several unique cooling features that ensure gaming PC maintain its performance while staying cool and quiet. Multiple fan headers can support PWM/DC fan and pump, and users can easily define each fan curve based on different temperature sensors across the board via intuitive user interface.

Fan Stop

Achieve fan silence. With Fan Stop, map any fan to stop completely when temperatures drop below a specified threshold. Which fan stops, based on readings from which sensor, and at what temperature—all of it can be customized to your liking.

PERFORMANCE

With the best quality components and GIGABYTE R&D design capability, the B560M AORUS is a true beast among motherboards.

XMP 4800+

Support for DDR4 XMP Up to 4800MHz and Beyond*

AORUS is offering a tested and proven platform that ensures proper compatibility with profiles up to 4800MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their AORUS motherboard.

* XMP Profile support may vary depending on memory module.
Please see the complete validated memory support list. Product features may vary by model.

Shielded Memory Routing

All memory routing is under the PCB inner layer shielded by a large ground layer to protect from external interference.

Memory Layout - Daisy Chain Design

With the optimized daisy-chain routing, the B560M AROUS motherboard provides a proven speed of up to DDR4-4800+ MHz with high-density Memory module*. Optimized daisy-chained routing eliminates the stub effect, pushes the one DIMM per channel in dual channel interleaving mode to hit higher memory frequencies, providing professional gamers a denser and faster system memory experience.

Single 32GB Support

The maximum memory capacity on the B560M motherboard is 128GB. After Intel updated the memory reference code, a single slot can support up to 32GB. Therefore with populated 2 DIMM per channel on both channel, total memory capacity is 128GB, which was only available on High End Desktop (HEDT) platforms. For users who always run out of memory capacity, there is more bandwidth now for memory-intensive application such as rendering and video editing.

*Performance may vary in circumstances. Please refer to the QVL list for detail support information.

Dual PCIe 4.0/3.0 x4 M.2

GIGABYTE AORUS Motherboards are focused on delivering M.2 technology to enthusiasts who want to maximize their system's potential.

NEXT GENERATION CONNECTIVITY

Intel 2.5GbE LAN Onboard

2X Faster than ever

  • Adoption of 2.5G LAN provide up to 2.5 GbE network connectivity, with at least 2 times faster transfer speeds compared to general 1GbE networking, perfectly designed for gamers with ultimate online gaming experience.
  • Support Multi-Gig(10/100/1000/2500Mbps) RJ-45 ethernet.

 

Front USB3.2 Gn1 Type-C®

USB Type-C® Front Panel Connector

Equipped with next generation connectivity AORUS Motherboards already support the chassis of the future. The onboard USB Type-C® header for USB 3.2 Gen1 makes access convenient when connecting a USB 3.2 Gen1 drive or charging your new mobile device.

AUDIO

High Quality Onboard Audio Design

Delivers high quality sound resolution and sound expansion to create the most realistic sound effects for professional gamers.

DEFINITIVE AESTHETICS

B560M AORUS PRO AX features RGB FUSION 2.0 and offers users the option to control onboard, external light strips, and/or AORUS devices with RGB/ Addressable RGB LEDs to make their PC more unique and stylish.

RGB FUSION

Multi-Zone Light Show Design

Now offering more LED customizations than ever, users can truly adapt their PC to represent their lifestyle. With full RGB support and a redesigned RGB Fusion 2.0 application, the user has complete control over the LEDs which surround the motherboard.

RGB FUSION Software

With an integrated intuitive user interface, the RGB Fusion 2.0 provides you a better solution for customizing the lighting effects across all supported devices. From motherboards, graphics cards to the peripheral products, you can personalize your gaming rig with your own style and show off your build by sharing the profiles. In addition, the new gaming mode makes the lighting effects interactive with selected games to bring you the most immersive gaming experience.

GIGABYTE RGB Fusion APP

Don't just make your PC shine, make it a work of art that friends will envy. With the GIGABYTE RGB Fusion mobile app users can watch as they control the lighting within their gaming PC. This gives users ease of access as they try and adjust colors and speeds for different modes, all this can be achieved away from the keyboard and monitor of their PC.

ULTRA DURABLE

GIGABYTE is reputable for its product durability and high quality manufacturing process. Needless to say, we use the best components we can find for the B560M AORUS motherboard and reinforce every slot to make each of them solid and durable.

Q-Flash Plus

Update the BIOS easily without installing the CPU, memory and graphics card.

With GIGABYTE Q-Flash Plus, you don’t need to install the CPU, memory and graphics card nor enter the BIOS menu to flash the BIOS. Just download and save a new BIOS file (rename to gigabyte.bin) on the USB flash drive, then press the dedicated Q-Flash Plus button and you’re good to go!

Ultra Durable™ PCIe Armor

Industry Leading Ultra Durable™ PCIe Armor

The innovative one piece stainless steel shielding design from GIGABYTE reinforces the PCIe connectors to provide the extra strength required to support heavy graphics cards.

Solid Pin Power Connectors

AORUS motherboards feature solid plated ATX 12V 8pin power connectors to offer a stable power supply during CPU overloading.

Solid Pin Power connector advantages

  • Larger contact area for electricity
  • More metal quantity to sustain higher power and generated heat
  • Ultra durable and longer lifespan

Main Features

  • Supports 11th and 10th Gen Intel Core Series Processors
  • Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs
  • Direct 12+1 Phases Digital VRM Solution with 50A DrMOS
  • Shielded Memory Routing for Better Memory Overclocking
  • Fully Covered Thermal Design with High Coverage MOSFET Heatsinks
  • Blazing Fast Intel 2.5GbE LAN with cFosSpeed
  • Dual Ultra-Fast NVMe PCIe 4.0*/3.0 x4 M.2 with Thermal Guard (* Actual support may vary by CPU.)
  • SuperSpeed USB 3.2 Gen2x2 TYPE-C delivers up to 20Gb/s Transfer Speeds
  • Pre-installed IO Shield for Easy and Quick Installation
  • RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips
  • Smart Fan 6 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP
  • Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card
Technical Specification

Gigabyte B560M AORUS PRO Intel Motherboard

  • CPU

  • LGA1200 package:
    1. 11th Generation Intel® Core™ i9 processors / Intel® Core™ i7 processors / Intel® Core™ i5 processors
    2. 10th Generation Intel® Core™ i9 processors / Intel® Core™ i7 processors / Intel® Core™ i5 processors / Intel® Core™ i3 processors/ Intel® Pentium® processors / Intel® Celeron® processors*
      * Limited to processors with 4 MB Intel® Smart Cache, Intel® Celeron® G5xx5 family.
    3. L3 cache varies with CPU
    (Please refer to "CPU Support List" for more information.)
  • Chipset

    1. Intel® B560 Express Chipset
  • Memory

    1. 11th Generation Intel® Core™ i9/i7/i5 processors:
      Support for DDR4 4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 3000 / 2933 / 2800 / 2666 / 2400 / 2133 MHz memory modules
    2. 10th Generation Intel® Core™ i9/i7 processors:
      Support for DDR4 2933/2666/2400/2133 MHz memory modules
    3. 10th Generation Intel® Core™ i5/i3 /Pentium®/Celeron® processors:
      Support for DDR4 2666/2400/2133 MHz memory modules
    4. 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
    5. Dual channel memory architecture
    6. Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
    7. Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
    8. Support for Extreme Memory Profile (XMP) memory modules
    (Please go to GIGABYTE's website for the latest supported memory speeds and memory modules.)
  • Onboard Graphics

  • Integrated Graphics Processor-Intel® HD Graphics support:
    1. 1 x HDMI port, supporting a maximum resolution of 4096x2160@30 Hz
      * Support for HDMI 1.4 version and HDCP 2.3.
    2. 1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz
      * Support for DisplayPort 1.2 version, HDCP 2.3
    (Graphics specifications may vary depending on CPU support.)
  • Audio

    1. Realtek® Audio codec
    2. High Definition Audio
    3. 2/4/5.1/7.1-channel
  • LAN

    1. Intel®2.5GbE LAN chip (2.5 Gbit/1 Gbit/100 Mbit)
  • Expansion Slots

    1. 1 x PCI Express x16 slot, running at x16 (PCIEX16)
      * For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot.
    2. (The PCIEX16 slot conforms to PCI Express 4.0 standard.)*
      *Supported by 11th Generation processors only.

    3. 1 x PCI Express x16 slot, running at x4 (PCIEX4)
    4. 1 x PCI Express x1 slot
      (The PCIEX4 and PCIEX1 slots conform to PCI Express 3.0 standard.)
  • Multi-Graphics Technology

    1. Support for AMD Quad-GPU CrossFire™ and 2-Way AMD CrossFire™ technologies
  • Storage Interface

  • CPU:
    1. 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2P_CPU)*
      * Supported by 11th Generation processors only.
    Chipset:
    1. 1 x M.2 connector on the back of the motherboard (Socket 3, M key, type 2260/2280/22110 SATA and PCIe 3.0 x4/x2 SSD support) (M2A_SB)
    6 x SATA 6Gb/s connectors
    * Refer to "1-7 Internal Connectors," for the installation notices for the M.2 and SATA connectors.
    Intel® Optane™ Memory Ready
  • USB

  • Chipset:
    1. 1 x USB Type-C® port on the back panel, with USB 3.2 Gen2x2 support
    2. 1 x USB 3.2 Gen2 Type-A ports (red) on the back panel
    3. 2 x USB 3.2 Gen1 ports on the back panel
    4. 2 x USB 2.0/1.1 ports on the back panel
    Chipset+USB 3.2 Gen 1 Hub:
    1. 1 x USB Type-C® port with USB 3.2 Gen1 support, available through the internal USB header
    2. 2 x USB 3.2 Gen1 ports available through the internal USB header
    Chipset+ 2 USB 2.0 Hub:
    1. 8 x USB 2.0/1.1 ports (4 ports on the back panel, 4 ports available through the internal USB headers)
  • Internal I/O Connectors

    1. 1 x 24-pin ATX main power connector
    2. 1 x 8-pin ATX 12V power connector
    3. 1 x CPU fan header
    4. 1 x water cooling CPU fan header
    5. 3 x system fan headers
    6. 2 x addressable LED strip headers
    7. 2 x RGB LED strip headers
    8. 6 x SATA 6Gb/s connectors
    9. 2 x M.2 Socket 3 connectors
    10. 1 x front panel header
    11. 1 x front panel audio header
    12. 1 x USB Type-C® header, with USB 3.2 Gen 1 support
    13. 1 x USB 3.2 Gen 1 header
    14. 2 x USB 2.0/1.1 headers
    15. 2 x Thunderbolt™ add-in card connectors
    16. 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
    17. 1 x serial port header
    18. 1 x Clear CMOS jumper
    19. 1 x Q-Flash Plus button
    *All fan headers are subject to support AIO_Pump, Pump and high performance fan with the capability of delivering up to 2A/12V @ 24W.
  • Back Panel Connectors

    1. 1 x PS/2 keyboard/mouse port
    2. 1 x USB Type-C® port, with USB 3.2 Gen2x2 support
    3. 1 x USB 3.2 Gen2 Type-A port (red)
    4. 2 x USB 3.2 Gen1 ports
    5. 6 x USB 2.0/1.1 ports
    6. 1 x DisplayPort
    7. 1 x HDMI port
    8. 1 x RJ-45 port
    9. 6 x audio jacks
  • I/O Controller

    1. iTE® I/O Controller Chip
  • H/W Monitoring

    1. Voltage detection
    2. Temperature detection
    3. Fan speed detection
    4. Water cooling flow rate detection
    5. Fan fail warning
    6. Fan speed control
      * Whether the fan speed control function is supported will depend on the cooler you install.
  • BIOS

    1. 1 x 256 Mbit flash
    2. Use of licensed AMI UEFI BIOS
    3. PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
  • Unique Features

    1. Support for APP Center
      * Available applications in APP Center may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications.
      @BIOS
      EasyTune
      Fast Boot
      Game Boost
      ON/OFF Charge
      RGB Fusion
      Smart Backup
      System Information Viewer
    2. Support for Q-Flash Plus
    3. Support for Q-Flash
    4. Support for Xpress Install
  • Bundled Software

    1. Norton® Internet Security (OEM version)
    2. cFosSpeed
  • Operating System

    1. Support for Windows 10 64-bit
  • Form Factor

    1. Micro ATX Form Factor; 24.4cm x 24.4cm

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